发明名称 Light-emitting diode module with heat dissipating structure and lamp with light-emitting diode module
摘要 A lamp (6) includes a housing (5) mounted to a lamp post (4) and a light-emitting diode module (10) mounted in the housing (5). The light-emitting diode module (10) includes a metal substrate (21) and a plurality of light-emitting diode dies (221) mounted on a face (211) of the metal substrate (21). A jacket (11) has a coupling surface (112) engaged with the other face (212) of the metal substrate (21). A heat conduction pipe (12) includes a portion (123) received in a longitudinal hole (111) of the jacket (11). The coupling surface (112) of the jacket (11) has an opening (114) in communication with the longitudinal hole (111). A portion of an outer periphery (124) of the portion (123) of the heat conduction pipe (12) is in direct, thermal contact with the other face (212) of the metal substrate (21) through the opening (114) of the jacket (11) to absorb heat generated by the light-emitting diode dies (221). A finned heat sink (13) is mounted on another portion (121) of the heat conduction pipe (12) outside the jacket (11) to dissipate heat transferred to the heat conduction pipe (12) into the environment.
申请公布号 EP2119961(A1) 申请公布日期 2009.11.18
申请号 EP20090360016 申请日期 2009.02.25
申请人 LIAO, YUN-CHANG 发明人 LIAO, YUN-CHANG
分类号 F21K9/00;F21S8/08;F21V19/00;F21V29/00;F21V29/51;F21V29/71;F21V29/76;F21V29/83;F21W131/103;F21Y103/10;F21Y107/30;F21Y115/10 主分类号 F21K9/00
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