A METHOD PRODUCING A BOAD HAVING MULTI-CHIP AND A BOAD HAVING MULTI-CHIP

摘要

Substrates having multi chips and a method for fabricating the same are provided to ground easily semiconductor chips mounted on a support plate by implementing the support plate as a metal material. Circuit lines are formed at both surfaces of a substrate(S10). A cavity penetrating from an upper surface of the substrate to a lower surface of the substrate is formed(S30). A support plate is inserted into the cavity(S60). Upper and lower chips are attached to the upper and lower surfaces of the substrate, respectively(S70). The upper chip and the circuit lines of the upper surface of the substrate are bonded using a conductive upper connection line. The lower chip and the circuit lines of the lower surface of the substrate are bonded using a conductive lower connection line.