| 摘要 |
PURPOSE: An LED package and a method of manufacturing of the same are provided to improve a luminous efficiency by radiating a light from an active layer through a reflector since a fluorescent pigment is not coated on the side of an LED chip. CONSTITUTION: In a LED package and a manufacturing method, an LED chip is mounted on the top of a reflector of an LED chip(10) at the first step. At the second step, a high volatile liquid mixed with a fluorescent material(30) is coated on the top of an assembly which is manufactured by the first step. The liquid is evaporated at the third step, at that time the fluorescent material is settled only on the top of the reflector and the LED chip because of the weight of the fluorescent material. |
