| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composite particle that has a high electromagnetic absorption efficiency per volume, does not precipitate oneself in a resin or resin solution and is lightweight, to provide an electromagnetic wave absorbing resin composition whose electromagnetic absorption efficiency per volume is high, can keep physical properties of a resin binder and is lightweight, does not precipitate oneself in a resin or resin solution, is lightweight and does not injure the covered material and to provide electronis parts of lightweight and compact, printed circuit board, semiconductor apparatus and packaging material . <P>SOLUTION: The composite particle 4 contains a base body 2 comprised of the first resin and a composite layer 3 that is as a united one of a ferromagnetic material with the first resin, the electromagnetic wave absorbing resin composition 1 contains the composite particle 4 and a binder 5 comprised of a second resin, the electronic parts, printed circuit board and packaged body are covered by the electromagnetic wave absorbing resin composition, and an electronic device installed on a printed circuit board of a semiconductor device is sealed by using the electromagnetic wave absorbing resin composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
