METHOD FOR FORMING EMBEDDED CAPACITOR IN FLEXIBLE PRINTED CIRCUIT BOARD

摘要

A method for forming an embedded capacitor in a flexible printed circuit board is provided to reduce a thickness, a size, and a weight of the printed circuit board by etching a dielectric. A method for forming an embedded capacitor in a flexible printed circuit board includes the steps of: forming a first photoresist film on upper and lower conductors formed at upper and lower parts of a flexible dielectric(S102); forming a predetermined pattern through exposure and development to remove an unnecessary region of the first photoresist film formed on the upper conductor(S103); removing the upper conductor exposed by removing the unnecessary first photoresist film with etching material(S104); separating the first photoresist film(S105); reducing a thickness by etching an unnecessary region of the flexible dielectric exposed by removing the upper conductor with the etching material(S106); forming a plating layer by performing electroless copper plating and electrolytic copper plating on the flexible printed circuit board(S107); forming a second photoresist film on the plating layer(S108); forming a predetermined pattern through exposure and development to remove a region except a necessary portion of the second photo resist film(S109); removing the plating layer and the upper and lower conductors exposed by removing the unnecessary second photoresist film with the etching material(S110); and separating the second photoresist film(S111).