| 摘要 |
A substrate processing device, wherein rinse nozzles (310a) to (310e) are moved over a wafer (W) while jetting rinse fluid (326) with jetting ports (317a) to (317e) brought into contact with developer (350) coated on the wafer (W) or the rinse fluid (326) on the wafer (W), whereby an impact on the wafer (W) can be relieved and a pattern falling can be avoided, and the developer (350) can be pushed by the front face of the rinse nozzle (310a).
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