| 摘要 |
PROBLEM TO BE SOLVED: To provide the positive thermosensitive resin composition useful for the resist material. SOLUTION: This positive thermosensitive resin composition comprises a (co)polymer of a p-hydroxy-α-methylstyrene compound and when needed, another unsaturated monomer copolymerizable with this compound, a resin having carboxyl groups, an olefinic unsaturated compound having an etherial bond, and a thermoacid-generator. A film formed from this composition, in parts irradiated with heat, is dissolved or dispersed in organic solvents or aqueous developing solutions but, in parts not irradiated with heat, is substantially not dissolved or dispersed in organic solvents or aqueous developing solutions. |
