| 摘要 |
To prevent occurrence of distortion in semiconductor cooling device and to prevent the semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor chip and the semiconductor cooling device are thermally expanded, a semiconductor cooling device (4) includes at least an upper plate (100a, 100b), an intermediate plate (3) and a lower plate (200a, 200b), and has a coolant inlet portion (101), an outlet portion (202) and a flow passage portion (31). The upper plate (100a, 100b) and the lower plate (200a, 200b) are composite plates constituted by plating copper maintaining a thickness of not smaller than 0.05 mm on one surface or on both surfaces of auxiliary plates (1 and 2) made of a material having a tensile strength of not smaller than 1000 N/mm 2 , a heat conductivity of not smaller than 100 W/m·K and a coefficient of thermal expansion of not larger than 6.0 ppm/°C (Fig. 4). |
