| 摘要 |
PROBLEM TO BE SOLVED: To provide a hermetic seal inspection method for inspecting a microfabricated structure in a simple and easy way. SOLUTION: For a microfabricated device 1 having a primary substrate 2 in which a microfabricated structure 4 and a primary annular conductive pattern 5 surrounding the microfabricated structure 4 are formed on the surface, a secondary substrate 3 in which a secondary annular conductive pattern 7 is formed on the surface opposed to the primary substrate 2, and a conductive sealing member 13 that is connected to the primary conductive pattern 5 and the secondary conductive pattern 7 and surrounds the microfabricated structure 4 for hermetical sealing, the hermetic seal inspection method inspects the hermetic seal of the microfabricated structure 4, wherein it measures an electrical resistance value between the primary conductive pattern 5 and the secondary conductive pattern 7 to determine the quality (good or bad) of the hermetic sealing of the microfabricated structure 4 based on the electrical resistance value. COPYRIGHT: (C)2009,JPO&INPIT
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