| 摘要 |
A camera module without a heat-welding process is provided to simplify a camera module manufacturing process by providing the camera module including a flexible printed circuit board composed of the duplex configuration. A pad(300) of a flexible printed circuit board(240) is made of an upper pad(310) and a bottom pad(320). The upper pad and the bottom pad are connected to a via-hole(330). The design pattern is easily secured by the design pattern through the via-hole. The surface of the bottom pad and the upper pad is plated on Sn. The down pad of the flexible printed circuit board applies the heat and power by using a soldering iron.
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