发明名称
摘要 A first metal layer of aluminum or an aluminum alloy is formed on a second interlayer insulating layer, and a second metal layer of silver or a silver alloy, which is patterned in the same pattern as the first metal layer, is formed on the first metal layer. The first metal layer and the second metal layer constitute wirings. The wirings are patterned in such a way as to overlie the gate lines and data lines of associated TFTs, and are laid out in such a way as to cover the TFTs.
申请公布号 JP4367161(B2) 申请公布日期 2009.11.18
申请号 JP20040034287 申请日期 2004.02.10
申请人 发明人
分类号 G02F1/1335;G02F1/1343;G02F1/1362;G02F1/1368;H01L21/3205;H01L23/52;H01L29/786 主分类号 G02F1/1335
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