| 摘要 |
PURPOSE: A substrate treating apparatus is provided to perform high productivity by improving a reaction speed of a substrate and a treating gas. CONSTITUTION: A substrate treating apparatus(100) includes a chamber main body part, a substrate supporting part, and an independent chamber part. The chamber main body part(200) has an entrance for a substrate. The substrate supporting part(300) is rotated inside the chamber main body part. The substrate supporting part has at least one through hole. In the substrate supporting part, the substrate is supported in a top part of the through hole. The independent chamber part(400) is provided as the number of through holes. The independent chamber part is moved from a bottom part of the through hole to a top part of the through hole, and loads the substrate. The independent chamber part forms an independent space with the chamber main body part.
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