| 摘要 |
Only the second component (25) of the solder (7) corresponds with (i.e. has identical composition to) and/or resembles the base material of the nickel-based part repaired. The melting point of the first component (22) of the solder, is lower than that of the base material of the part. The melting point of the second component of the solder, lies below that of the base material of the part. The melting point of the second component of the solder lies between the melting point of the base material of the part, and the melting point of the first component (22) of the solder. The melting point of the first component (22) of the solder (7) is between that of the base material of the part, and that of the second component (25) of the solder (7). The solder has two powdered metal components. The grain size of the first is in the range 7-100 mu m. The grain size of the second is up to 500 nm. The melting point of the first component (22) is less than (or greater than) that of the second. The first component (22) is an alloy; the second (25) is also an alloy. There is no material reducing melting point, e.g. boron, in the first and/or second component. Alternatively the first component has preferably only one material reducing melting point. This is especially carbon, boron, hafnium, silicon or zirconium. The volumetric proportion of the first component (22) in the solder, is the greatest. The first component and/or the second component are nickel-based. The first component (22) includes preferably only one material reducing melting point, especially tantalum or titanium. |
