REMOVAL OF SURFACE OXIDES BY ELECTRON ATTACHMENT

摘要

PURPOSE: A method for removing surface oxide by electron attaching is provided to remove metal oxide easily from the surface of a substrate such as an insulated substrate by adding a fluxless solder reflow process under noncombustible air environment. CONSTITUTION: A device for removing surface oxide by electron attaching includes a substrate(20), an energizing electrode(24) located around a base electrode and the substrate, and a conductive tip. The substrate includes a processing surface having metal oxide. A part of the processing surface is exposed to the energizing electrode. The energizing electrode is limited by an insulating plate including conductive tip.