| 摘要 |
<p>White LED device 20 includes LED chip 13 mounted on substrate 1 made of metal, sealing resin 11 that seals LED chip 13; and glass member 12 formed on sealing resin 11. Glass member 12 contains phosphor 22 and thermal conductivity of sealing resin 11 is lower than that of glass member 12.</p> |
