| 摘要 |
A supersonic nozzle and a wafer cleaning apparatus are provided to prevent the damage to a pattern formed on a semiconductor substrate, and to wash the substrate precisely and uniformly. A substrate cleaning apparatus comprises a ultrasonic nozzle(290) authorizing the supersonic vibration in the washing solution supplied to the upper side of the semiconductor substrate. The ultrasonic nozzle comprises ultrasonic oscillators(232,234,238) which provides the vibration energy having a plurality of frequencies and a housing(240) receiving the ultrasonic oscillator. The ultrasonic oscillator comprises a transmitter which vibrates by a transducer and a transducer converting the electrical energy into the vibration energy. The transmitter is arranged on the top of the semiconductor substrate supported in the supporting part. The transmitter authorizes the supersonic vibration in the washing solution supplied through the first nozzle to the upper side of the semiconductor substrate.
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