| 摘要 |
An apparatus for interconnecting stacked dice on a programmable integrated circuit is described. In one example, an integrated circuit die comprises a programmable integrated circuit that includes first and second interface tiles. The first interface tile is in electrical communication with a first array of pins on the integrated circuit die, and the second interface tile is in electrical communication with a second array of pins on the integrated circuit die. At least one dedicated routing resource is formed on the integrated circuit die between the first interface tile and the second interface tile. The at least one dedicated routing resource is configured to couple at least one pin of the first array of pins to at least one pin of the second array of pins.
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