发明名称 Metal powder for electrically conductive paste and electrically conductive paste
摘要 A metal powder for a conductive paste has an average particle diameter D50 not greater than 5 mum and an X value defined by equation (1) not greater than 0.5: X value=D50 (mum)/BET specific surface area (m2/g) (1) The metal powder for a conductive paste is particularly preferable when wart-like projections of a diameter not greater than 150 nm are present on the particle surfaces. Typical types of the metal powder include Cu, Ag, Au, Pd, Pt, Ni, Al and alloys thereof. The metal powder for a conductive paste enables fabrication of a conductor having a low void ratio after the paste is fired.
申请公布号 US7618475(B2) 申请公布日期 2009.11.17
申请号 US20060340652 申请日期 2006.01.27
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 YAMASHINA HIROYUKI;FUJITA HIDEFUMI;IBARAKI TATSUYA
分类号 B22F1/00 主分类号 B22F1/00
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