| 摘要 |
PURPOSE: A method for manufacturing a solid imaging device and the method for manufacturing an electric device are provided to form an on-chip filter of the red, green, and blue by pattering a resist film. CONSTITUTION: A signal circuit is formed on a first surface of a semiconductor substrate forming a photoelectric converter though an interlayer insulation layer(14). The light is inputted from a second surface of the semiconductor substrate to the photoelectric converter. An on-chip color filter(19) and an on-chip micro lens(21a) are formed on the second surface to which the light is inputted. After forming the on-chip color filter and the on-chip micro lens, an opening is formed on a pad unit of the second surface to which the light is inputted.
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