发明名称 Method for fabricating embedded thin film resistors of printed circuit board
摘要 A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.
申请公布号 US7617591(B2) 申请公布日期 2009.11.17
申请号 US20070669157 申请日期 2007.01.31
申请人 SU SUNG-LING;XU ZHIQIANG 发明人 SU SUNG-LING;XU ZHIQIANG
分类号 H01C17/00;H01C7/00;H01C17/06;H01C17/075;H01C17/28;H05K1/16;H05K3/06;H05K3/18 主分类号 H01C17/00
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