Touch auto-calibration of process modules

摘要

Methods and systems for the touch auto-calibration for robot placement of substrate in process modules are provided. Touch auto-calibration allows for the automatic calibration of robot end effector positioning with respect to an aligning base in a process module. Touch auto-calibration also allows for calibration of process modules at temperatures and pressures similar to the temperatures and pressures experienced during production. The end effector has one or more aligning surfaces configured to align it with the aligning base upon contact with the aligning base. After contact, the position of the end effector and the calibrated position of the end effector during a pick or place move can then be determined. In some implementations, the positioning of the end effector as it transfers a substrate during production is based on a placement coordinate with the placement correction applied.

主权项

1. A method comprising:
moving an end effector, in a semiconductor process tool, with one or more aligning surfaces towards an aligning base until all of the one or more aligning surfaces are contacting the aligning base at the same time, wherein the one or more aligning surfaces are protrusions extending away from a first surface of the end effector; measuring a torque value applied by a motor operable to move the end effector; detecting contact of all of the one or more aligning surfaces with the aligning base from the torque value; determining, by a processor, a placement coordinate of the end effector when all of the one or more aligning surfaces are contacting the aligning base at the same time; and determining, by the processor, a substrate transfer position for the end effector using the placement coordinate.