Device and method for localized underfill

摘要

A device and method for localizing underfill includes a substrate, a plurality of dies, and underfill material. The substrate includes a plurality of contacts and a plurality of cavities separated by a plurality of mesas. The plurality of dies is mounted to the substrate using the plurality of contacts. The underfill material is located between the substrate and the dies. The underfill material is localized into a plurality of regions using the mesas. Each of the contacts is located in a respective one of the cavities. In some embodiments, the substrate further includes a plurality of channels interconnecting the cavities. In some embodiments, the substrate further includes a plurality of intra-cavity mesas for further localizing the underfill material. In some embodiments, outer edges of a first one of the dies rest on first mesas located on edges of a first one of the cavities.

主权项

1. A semiconductor package, the package comprising:
a substrate comprising a plurality of contacts and a plurality of cavities separated by a plurality of mesas, each of the contacts being located in a respective one of the cavities; a plurality of dies mounted to the substrate using the plurality of contacts; a plurality of channels interconnecting the cavities; and an underfill material between the substrate and the dies; wherein the underfill material is localized into a plurality of regions using the mesas.