| 发明名称 |
Polishing pad for electrochemical mechanical polishing |
| 摘要 |
The present invention provides polishing pad for electrochemical mechanical polishing. The pad comprises a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm.
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| 申请公布号 |
US7618529(B2) |
申请公布日期 |
2009.11.17 |
| 申请号 |
US20040854321 |
申请日期 |
2004.05.25 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC |
发明人 |
AMEEN JOSEPH G.;JAMES DAVID B. |
| 分类号 |
B23H5/08;B24B37/00;B23H3/00;B24B37/04;B24D3/28;B24D13/14;C25F7/00;H01L21/304 |
主分类号 |
B23H5/08 |
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