发明名称 Integrated connection arrangements
摘要 A connection arrangement having an outer conductive structure arranged at least partly or completely in a cutout of an electrical insulation layer is provided. An inner conductive structure is arranged at the bottom of the cutout on one side of the insulation layer. The inner conductive structure adjoins the outer conductive structure in a contact zone. A contact area is arranged at the outer conductive structure on the other side of the cutout. The contact zone and the contact area do not overlap. The bottom of the cutout is arranged to overlaps at least half of the contact area, to provide a step in the insulation layer at the edge of the cutout outside a main current path between the contact area and the inner conductive structure.
申请公布号 US7619309(B2) 申请公布日期 2009.11.17
申请号 US20060350518 申请日期 2006.02.09
申请人 INFINEON TECHNOLOGIES AG 发明人 DREXL STEFAN;GOEBEL THOMAS;HELNEDER JOHANN;HOMMEL MARTINA;KLEIN WOLFGANG;KORNER HEINRICH;MITCHELL ANDREA;SCHWERD MARKUS;SECK MARTIN
分类号 H01L23/48;H01L21/4763;H01L23/485;H01L23/52;H01L23/532;H01L29/40 主分类号 H01L23/48
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