CHIP STRUCTURE HAVING BONDING WIRE

摘要

A chip structure includes a chip, a first metal layer, a second metal layer and a bonding wire. The first metal layer is disposed on the chip, and a material of the first metal layer includes nickel or nickel alloy. The second metal layer is disposed on the first metal layer, and a material of the second metal layer includes copper, copper alloy, aluminum, aluminum alloy, palladium or palladium alloy. The bonding wire is connected to the second metal layer, and a material of the bonding wire includes copper or copper alloy.

主权项

1. A chip structure, comprising:
a chip; a first metal layer, disposed on the chip, a material of the first metal layer comprising nickel or nickel alloy; a second metal layer, disposed on the first metal layer, a material of the second metal layer comprising copper or copper alloy; and a wedge bonding wire, wedge bonded to the second metal layer, a material of the wedge bonding wire comprising copper or copper alloy.