| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which enables downsizing while achieving good heat radiation effect of an amplifier circuit element and good heat shielding effect.SOLUTION: An electronic component includes: a substrate having a first major surface and a second major surface and including a cavity formed on the first major surface side; and an amplifier circuit element housed in the cavity. The amplifier circuit element is an electronic component fixed in the cavity by a sealing resin. A conductor member covers the cavity while contacting with the sealing resin and the amplifier circuit element. Heat is also radiated from the sealing resin through the conductor member. Further, the conductor member may be connected with thermal via holes connecting the first major surface side with the second major surface side of the substrate.SELECTED DRAWING: Figure 1 |
