发明名称 LASER PROCESSING METHOD FOR TRANSPARENT PLATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser processing method for a transparent plate which forms a laser processed groove in a transparent plate such as a glass plate without incurring cracks. <P>SOLUTION: The laser processing method for a transparent plate having a predetermined breaking line includes a step of applying a pulsed laser beam to the transparent plate along the breaking line to thereby form a laser processed groove. The pulsed laser beam has an absorption wavelength to the transparent plate. The repetition frequency of the pulsed laser beam is set to 200 kHz or more and the energy density per pulse of the pulsed laser beam is set to 3.8 J/cm<SP>2</SP>or more. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009262188(A) 申请公布日期 2009.11.12
申请号 JP20080113846 申请日期 2008.04.24
申请人 DISCO ABRASIVE SYST LTD 发明人 MORIKAZU YOJI;HONJO KEIJI;ASANO KENJI
分类号 B23K26/00;B23K26/40;C03B33/09;G02F1/13;G02F1/1333 主分类号 B23K26/00
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