| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board by which a wiring board having a gold plating layer deposited thereon by electrolytic plating, the plating layer having a uniform crystal structure with less thickness irregularities, can be manufactured in a highly productive manner. Ž<P>SOLUTION: The method of manufacturing the wiring board includes the steps of: forming a plurality of insulating substrates 1 each having a wiring conductor 2 on its upper surface in a mother substrate 10 large enough to include the insulating substrates 1 configured such that the insulating substrates 1 are lined up vertically and horizontally with cutting areas A interposed on boundaries between the insulating substrates 1; forming a first tie-bar T1 electrically connected to the wiring conductor 2 on the upper surface of each cutting area A while forming a second tie-bar T2 electrically connected to the first tie-bar T1 on the undersurface of the cutting area A; and supplying electric charges to the wiring conductor 2 via the first and second tie-bars T1 and T2 for electrolytic plating to deposit a gold plating layer G on the exposed surface of the wiring conductor 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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