| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem: a conventional piezoelectric speaker using a PZT is less consistent with a CMOS semiconductor process used for a dedicated driver IC, in the manufacturing process of the piezoelectric speaker, and hence it is difficult to integrate the piezoelectric speaker and a signal processing circuit, and even when bulk MEMS (MIcro Electro Machining System) technique and a piezoelectric thin film are used, integration with a signal processing circuit formed on a semiconductor substrate is not achieved yet and the signal processing circuit needs to be separately provided, consequently it is difficult to make compact an acoustic transducer. Ž<P>SOLUTION: The acoustic transducer includes the signal processing circuit formed on the semiconductor substrate and a diaphragm part functioning as an acoustic transducer integrally with the substrate. In the acoustic transducer, the diaphragm part is partitioned by a space part, i.e. a cavity formed between the substrate. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
