发明名称 Printed circuit board and manufacturing method thereof
摘要 A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern by inkjet printing on the insulation layer coated with the chemical compound. Certain embodiments of the invention can be utilized to improve adhesive strength between the insulation layer and the inkjet-printed circuit patterns, suppress spreading in the inkjet-printed circuit patterns to improve resolution, and reduce manufacturing costs by forming the circuits using inkjet printing.
申请公布号 US2009277674(A1) 申请公布日期 2009.11.12
申请号 US20090320742 申请日期 2009.02.03
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OH SUNG-II;JOUNG JAE-WOO;KIM TAE-HOON;CHO SUNG-NAM
分类号 H05K1/00;B05D3/00;B05D5/12 主分类号 H05K1/00
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