发明名称 |
Semiconductor Chip Bump Connection Apparatus and Method |
摘要 |
Various semiconductor chip packages and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a solder bump to a side of a semiconductor chip and bringing the solder bump into contact with a conductor pad coupled to a substrate and positioned in an opening of a solder mask on the substrate. The conductor pad has a first lateral dimension and the opening has a second lateral dimension that is larger than the first lateral dimension. A metallurgical bond is established between the solder bump and the conductor pad.
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申请公布号 |
US2009278264(A1) |
申请公布日期 |
2009.11.12 |
申请号 |
US20080119174 |
申请日期 |
2008.05.12 |
申请人 |
TOPACIO RODEN R;CHAN VINCENT;YEUNG FAN |
发明人 |
TOPACIO RODEN R.;CHAN VINCENT;YEUNG FAN |
分类号 |
H01L23/498;H01L21/60 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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