发明名称 ELECTROCHEMICAL DEVICE AND PACKAGING STRUCTURE THEREOF
摘要 <p>Provided is an electrochemical device that is compatible with high temperature reflow soldering using lead-free solder. An electrical double-layer capacitor (10-1) has a structure in which a positive pole terminal (12) and a negative pole terminal (13) are exposed from a package (14) in which an electric storage element (11) is sealed. The entire package (14) and the base parts of the exposed parts of the positive pole terminal (12) and the negative pole terminal (13) are covered using a thermal insulating material (16) with heat conductivity lower than that of package (14).</p>
申请公布号 WO2009136660(A1) 申请公布日期 2009.11.12
申请号 WO2009JP58958 申请日期 2009.05.07
申请人 TAIYO YUDEN CO., LTD.;YAWATA, KAZUSHI;KOBAYASHI, MOTOKI;ISHIDA, KATSUEI;HAGIWARA, NAOTO 发明人 YAWATA, KAZUSHI;KOBAYASHI, MOTOKI;ISHIDA, KATSUEI;HAGIWARA, NAOTO
分类号 H01G9/08;H01G11/12;H01G11/18;H01G11/74;H01G11/76;H01G11/82;H01M2/02;H01M2/06;H01M2/10;H01M10/50 主分类号 H01G9/08
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