| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device that enables adjustment of the size of a portion to be adjusted in size, and to provide a semiconductor device manufacturing apparatus which is suitable for the method. SOLUTION: The manufacturing method for the semiconductor device includes a size measuring step S8 of measuring the size of a portion to be adjusted in size, determining steps S9 and S11 of determining whether a measurement obtained at the size measuring step S8 is larger than a reference value, and a size-adjusting step of carrying out either a first step of reducing the portion, when the measurement is determined to be larger than the reference value at the determining steps S9 and S11 or a second step of enlarging the portion, when the measurement is determined as being smaller than the reference value in the determining steps. COPYRIGHT: (C)2010,JPO&INPIT |
