发明名称 MOUNTING STRUCTURE OF RESIN COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a mounting structure of a resin component improving appearance and enhancing merchantability by suppressing the positional shift between an instrument panel body and the resin component. <P>SOLUTION: The mounting structure of the resin component is equipped with a first engagement means provided for the resin component 20 and engaged with the instrument panel body 53 to a second direction different from a first direction while regulating relative movement to the predetermined first direction relative to the instrument panel body 53, and second engagement means 72, 86 arranged on boundary parts 71, 85 between the resin component 20 and the instrument panel body 53 for regulating relative movement of the resin component 20 to a third direction relative to the instrument panel body 53. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009262879(A) 申请公布日期 2009.11.12
申请号 JP20080117811 申请日期 2008.04.28
申请人 HONDA MOTOR CO LTD 发明人 SATO TADASHI;TATEISHI KAZUYUKI
分类号 B60K37/00;B60H1/34;B60R21/20;B60R21/205;B60R21/215 主分类号 B60K37/00
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