| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device and a bonding defect detection method by which bonding defects can be detected even for an object incapable of securing temperature uniformity in a plurality of electrodes in the electronic component mounting of bonding the plurality of electrodes at the same time. <P>SOLUTION: In a process of bonding a substrate 8 with a plurality of electrodes and an IC 7 with a plurality of electrodes by heat and pressure, a thermometer which measures substrate lower surface temperatures at a plurality of arbitrary positions is provided, so that a bonding defect during bonding can be precisely detected. Even when a plurality of ICs are press-bonded at the same time, bonding states can be individually comprehended, so that a bonding defect during bonding can be precisely detected. <P>COPYRIGHT: (C)2010,JPO&INPIT |
