发明名称 Mikromechanisches Bauelement und Herstellungsverfahren hierfür
摘要 A micromechanical component has a semiconductor body (11) with at least one structural layer (1,10) which is movable relative to the semiconductor body and which includes a flat, elongated portion(10). Electrodes (2,3) are provided for forming a sensor or actuator. At least one further portion (1) is provided normal to the flat, elongated portion (10) and has, in a plane coplanar to the flat, elongated portion, in at least one direction, a dimension which, at the most is equal to twice the thickness of the flat, elongated portion, the further portion (1) of the structural layer specifically being designed electrically conductively as an electrode arranged opposite an electrode (2,3) fixedly mounted relative to the semiconductor body (11).
申请公布号 DE19852878(B4) 申请公布日期 2009.11.12
申请号 DE1998152878 申请日期 1998.11.16
申请人 INFINEON TECHNOLOGIES AG 发明人 AIGNER, ROBERT;OPPERMANN, KLAUS-GUENTER
分类号 B81B3/00;B81C1/00;G01P15/08;G01P15/125 主分类号 B81B3/00
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