| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a wiring pattern which is free from cracks and is superior in line width reproducibility, adhesion, and conductivity and furthermore is superior in decapping. <P>SOLUTION: In a wiring pattern forming method where an underlying layer is formed on a base by a liquid containing a cationic compound and conductive ink having a zeta potential of -100 to 0 mV is injected onto the underlying layer by an inkjet recorder, the cationic compound contains a cationic surfactant or at least one of cationic polymers having a molecular weight of 100 to 100,000. <P>COPYRIGHT: (C)2010,JPO&INPIT |
