| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem, wherein the conventional semiconductor device with an antenna mounted has a possibility of being short in the heat which dissipates from the mounted semiconductor element. <P>SOLUTION: An antenna 24 formed on one surface side of a silicon substrate 18 and a semiconductor element 20 mounted to the other surface side of the silicon substrate 18 are electrically connected to each other via a through-via 26 penetrating the silicon substrate 18, while being formed on a separate body from the silicon substrate 18. A wiring substrate 10, to which one suface side a passive element is mounted and the silicon substrate 18 are electrically connected to each other via a copper core solder ball 34, which is provided between one surface side of the wiring substrate 10 and the other surface side of the silicon substrate 18. <P>COPYRIGHT: (C)2010,JPO&INPIT |
