| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that when a metal connection plate fixed by a fixing material is used as a connection means for connecting a semiconductor element and leads, the metal connection plate is deviated and connected due to the surface tension of the fixing material. <P>SOLUTION: This semiconductor device 10 includes: a semiconductor element 18 having an electrode disposed on a main surface; a lead 12A electrically connected to the semiconductor element 18 and partially protruded to the outside; and a metal connection plate 16A fixed to the electrode of the semiconductor element 18 and the lead 12A via fixing materials 32, 34. The metal connection plate 16A on the electrode side of the semiconductor element 18 from the end of the lead 12A protrudes in a thickness direction, thereby forming a protruding portion 28A. By this, even if the surface tension of the molten fixing material 32 acts on the metal connection plate 16A, the protruding portion 28A contacts with the side surface of the lead 12A, thereby suppressing the movement of the metal connection plate 16A. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
