| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting structure and a wiring board with high reliability, and to provide a method of manufacturing the wiring board. <P>SOLUTION: The mounting structure 1 includes: the wiring board 2 wherein an insulating layer 6 and a conductive layer 5 are laminated, comprising a via conductor 9 which is provided at the insulating layer 6 and connected to the conductive layer 5 by one end side; and a semiconductor device 3 which is mounted on the wiring board 2 and connected to the other end side of the via conductor 9. The via conductor 9 is gradually decreased in width from one end side to the other end side, and part of the via conductor 9 protrudes from the surface of the insulating layer 6. A protrusion 9c of the via conductor 9 includes a constricted part 9a on the way in protruding direction, and is connected to the semiconductor device 3. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
