| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable contributing to further miniaturization by enabling bumps and an inductor to coexist on a single substrate even when the inductor is somewhat large compared to a substrate area. <P>SOLUTION: The semiconductor device 1A(1) includes: a semiconductor substrate 10 equipped with an electrode 3 on at least one surface; a first insulating resin layer 11 disposed so as to cover one surface of the semiconductor substrate; a first conductive layer 12 disposed on the first insulating resin layer and electrically connected to the electrode; a second insulating resin layer 13, a second conductive layer 14, a third insulating resin layer 15 and a third conductive layer 16 which are sequentially disposed on the first conductive layer; and bumps 17 electrically connected to the third conductive layer. In the semiconductor device, one part of the second insulating layer constitutes a portion 14a functioning as the inductor, one end as a residual portion of the second conductive layer and the other end are electrically connected to the first conductive layer and the third conductive layer respectively, and the bumps and the portion are at a position where at least one parts thereof overlap each other in plan view. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
