| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and a device for cutting a single crystal sapphire substrate accurately in the direction of from parallel to within 1°relative to a (1-102) surface (r surface) of a single crystal sapphire with a super abrasive grain wire saw. <P>SOLUTION: The direction of cutting of the super abrasive grain wire saw is from parallel to within 5°relative to the (1-102) surface (r surface) of the single crystal sapphire, and the running direction of the super abrasive grain wire saw is from parallel to within 5°relative to the (11-20) surface (a surface) of the single crystal sapphire. An accurate single crystal sapphire substrate having the r surface as a main surface is thereby provided. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
