发明名称 Method Of Producing Semiconductor Wafer
摘要 A semiconductor wafer is produced by irradiating a laser beam to either face of a semiconductor wafer so as to fit a focusing position into a given depth position of the semiconductor wafer to generate a multiphoton absorption process only in a specific portion of the semiconductor wafer at the given depth position to thereby form a gettering sink.
申请公布号 US2009280623(A1) 申请公布日期 2009.11.12
申请号 US20090436711 申请日期 2009.05.06
申请人 SUMCO CORPORATION 发明人 KURITA KAZUNARI
分类号 H01L21/268;H01L21/322 主分类号 H01L21/268
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