发明名称 |
METHODS OF FABRICATING INTERCONNECT STRUCTURES CONTAINING VARIOUS CAPPING MATERIALS FOR ELECTRICAL FUSE AND OTHER RELATED APPLICATIONS |
摘要 |
Methods are provided for fabricating interconnect structures containing various capping materials for electrical fuses and other related applications. The method includes forming a first interconnect structure having a first interfacial structure and forming a second interconnect structure adjacent to the first structure. The second interconnect structure is formed with a second interfacial structure different from the first interfacial structure of the first interconnect structure.
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申请公布号 |
US2009280636(A1) |
申请公布日期 |
2009.11.12 |
申请号 |
US20080118161 |
申请日期 |
2008.05.09 |
申请人 |
HSU LOUIS L;TONTI WILLIAM R;YANG CHIH-CHAO |
发明人 |
HSU LOUIS L.;TONTI WILLIAM R.;YANG CHIH-CHAO |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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