| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive ball removing method, a conductive ball mounting method, a conductive ball removing apparatus, and a conductive ball mounting apparatus capable of removing excess conductive balls without fail without scattering conductive balls. <P>SOLUTION: In a method in which a mask 12 having a plurality of through parts 12A corresponding to pads 27 is arranged on a substrate having the pads 27, and after conductive balls 38 are mounted on the mask 12, the conductive balls 38 not mounted directly on the pads 27 are removed, there is provided a contacting step of making a sheet member 82 configured to cause the conductive ball 38 to adhere thereto is caused to come into contact with the mask 12 and thereby the conductive ball 38 is removed after it is caused to adhere to the sheet member 82. <P>COPYRIGHT: (C)2010,JPO&INPIT |
