| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a new method for filling a connecting conductor to a bottomed hole formed in a sheet material for forming a multi-layer circuit board which does not need a protection film, and a filling device. <P>SOLUTION: In the method for filling the connecting conductor, the connecting conductor D2 of about the same diameter as the bottomed hole H, is filled to the bottomed hole H formed in the sheet material 11 for forming the multi-layer circuit board. An elastic body 31 includes a diaphragm part 31a formed in a recessed shape in the center portion, and a lip part 31b formed in a shape of V in the perimeter portion. The connecting conductor D2 is held to a concave portion of the diaphragm part 31a. The lip part 31b of the elastic body 31 is made to contact from a vertical downward direction to the sheet material 11 holding an opening portion of the bottomed hole H directed to the vertical downward direction. The diaphragm part 31a holding the connecting conductor D2 is pressed from the outside. The diaphragm part 31a is deformed to push and fill the connecting conductor D2 into the bottomed hole H. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
