| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermally conductive resin composition giving a small molded body which exhibits good thermal conductivity and low anisotropy of the thermal conductivity while maintaining an electrical insulation property preferable as an electric-electronic component; and to provide a molded body produced by using the thermally conductive resin composition. SOLUTION: The thermally conductive resin composition includes the following components (A) to (C): (A) a thermoplastic resin, (B) alumina fine particles and (C) a plate-like filler, wherein the component (B) is contained in an amount larger than the amount of the component (C); and the resin composition has a specific volume resistance of 1×10<SP>10</SP>Ωm or more at 23°C. Here, the plate-like filler is preferably talc. The molded body provided from the thermally conductive resin composition has such well reduced anisotropy of thermal conductivity that the thermal conductivity in an MD direction in accordance with a melt process is 2 or less as compared to that in a TD direction. COPYRIGHT: (C)2010,JPO&INPIT |
