发明名称 LIGHT MODULE PACKAGE
摘要 The invention relates to a mounting substrate (10) for mounting and electrically contacting at least one light emitting diode (20), a ceramic layer (40) disposed in a path of light emitted by the light emitting diode (20), wherein the ceramic layer (40) comprises a wavelength converting material, the light emitting diode (20) disposed between the ceramic layer (40) and the mounting substrate (10), a light sensor (30) disposed at the mounting substrate (10) detecting a luminous output of the light emitting diode (20) in order to control the brightness and/or the color of the light leaving the light module (1), wherein the ceramic layer (40) is only partly translucent to shield the light sensor (30) against ambient light.
申请公布号 US2009278034(A1) 申请公布日期 2009.11.12
申请号 US20070439810 申请日期 2007.09.20
申请人 KONINKLIJKE PHILIPS ELECTRONICS N V 发明人 ACKERMANN BERND;BECHTEL HANS-HELMUT;HILGERS ACHIM;WENDT MATTHIAS
分类号 G01J1/04;H01L33/50 主分类号 G01J1/04
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