发明名称 METHOD OF MOUNTING PIEZOELECTRIC VIBRATION ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of mounting a piezoelectric vibration element with which the piezoelectric vibration element is prevented from being ruptured or the vibration property thereof from becoming unstable, without applying thermal stress caused by a rapid temperature change to the piezoelectric vibration element. Ž<P>SOLUTION: A method of mounting a piezoelectric vibration element includes: an adhesive applying step S1 of providing a conductive adhesive on an electrode pad for piezoelectric vibration element connection; an element placing step S2 of bringing the piezoelectric vibration element into contact with the conductive adhesive and placing the element inside a recessed portion while taking such an attitude as not to bring the principal surface thereof into contact but to be in parallel with a bottom surface inside the recessed portion; a first adhesive hardening step S3 of irradiating only the conductive adhesive with laser light, temporarily hardening the conductive adhesive and supporting the piezoelectric vibration element; and a second adhesive hardening step S4 of heating again the temporarily hardened conductive adhesive, completely hardening the conductive adhesive, and conducting and affixing the piezoelectric vibration element on the electrode pad for piezoelectric vibration element connection via the conductive adhesive. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009267862(A) 申请公布日期 2009.11.12
申请号 JP20080116361 申请日期 2008.04.25
申请人 KYOCERA KINSEKI CORP 发明人 SOEJIMA MUNETAKA
分类号 H03H3/02;H03H9/10 主分类号 H03H3/02
代理机构 代理人
主权项
地址