| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board which allows simplification of a manufacturing process, and to provide a method of manufacturing the printed wiring board. Ž<P>SOLUTION: The printed wiring board 1 includes a metallic substrate 2, an insulating layer 3 formed on the surface of the metallic substrate 2, an adhesive layer 6 formed on the surface of the insulating layer 3 and composed of polyimide resin having a glass transition temperature of 20 to 300°C and thermoplasticity, and a metallic foil layer 8 formed on the surface of the adhesive layer 6. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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